User login


Can You Copperplate?


Source Institutions

    IEEE

Add to listGo to activity
Can You Copperplate?

In this activity, learners explore chemical engineering and how the processes of chemical plating and electroplating have impacted many industries. Learners work in teams to copperplate a range of items using everyday materials. They develop a hypothesis about which materials and surface preparations will result in the best copper plate, present their plans, test their process, evaluate their results and those of others, and share observations.

Quick Guide


Preparation Time:
Under 5 minutes

Learning Time:
1 to 2 hours

Estimated Materials Cost:
$10 - $20 per group of students

Age Range:
Ages 11 - 18

Resource Types:
Activity, Experiment/Lab Activity, Lesson/Lesson Plan

Language:
English

Materials List (per group of students)


Subjects


  • Engineering and Technology
    • Engineering
      • Chemical Engineering
      • Metallurgy and Materials Engineering
  • Physical Sciences
    • Electricity and Magnetism
      • Electric Charges and Currents
      • Electric Circuits
    • Chemistry
      • Chemical Reactions
      • Acids and Bases
      • Oxidation-Reduction Reactions
    • Structure and Properties of Matter
      • Atomic Structure
      • Elements and Periodic Table
  • The Nature of Science
    • The Scientific Process
      • Conducting Investigations
      • Gathering Data
      • Formulating Explanations
      • Communicating Results
  • The Nature of Technology
    • Technology and Society
      • Impacts of Technology
    • The Design Process

Informal Categories


  • Financial Literacy

Audience


To use this activity, learners need to:

  • see
  • see color
  • read
  • touch

Learning styles supported:

  • Involves teamwork and communication skills
  • Involves hands-on or lab activities

Other


Components that are part of this resource:

Includes alignment to state and/or national standards

This resource is part of:

Access Rights:

  • Free access

By:

Rights:

  • All Rights Reserved, IEEE,

Share